Due to a series of special technical requirements in the electronics industry, electronic ceramics are very different from general engineering ceramics in terms of microstructure, chemical composition and electrical properties. For example, high mechanical strength, high temperature resistance, high humidity resistance, radiation resistance, high electrical strength and insulation resistance, medium can be varied within a wide enough range, etc. These are are inseparable from electronic ceramics.

Among the types of electronic ceramics, on the basis of these characteristics, the alumina electronic ceramic substrate has the advantage of lower cost, and thus it is one of the most commonly used substrate types. The manufacturing technology of the alumina ceramic substrate mainly includes two parts: preparation and slitting of the substrate, and surface processing technology. Although both are equally important, the latter is the basis and guarantee for the production of electronic components.

Under normal circumstances, people will use "rough grinding + fine polishing" to make the alumina electronic substrate "clean and smooth", but different processing methods and abrasive selection will affect the surface processing effect.First, before the abrasive particles enter the polishing area of the workpiece, agglomeration may occur to make the abrasive grains larger, thereby causing greater damage to the workpiece. In the single-side polishing process, the abrasive particles need to pass through the trimming ring before entering the polishing area. In addition to positioning the ceramic mounting plate, the trimming ring also separates and breaks the agglomerated abrasive by its own pressure, so that the abrasive maintains a uniform particle size.

Second, single-side polishing is performed by rotating the polishing disk and the circular ceramic disk, and the resulting workpiece has less jitter, so that the removal efficiency of the workpiece to the workpiece is higher, and the surface damage is less; and the double-side polishing is the workpiece loading.The mesh movement between the upper and lower polishing discs is achieved by the meshing of the central shaft gear and the outer ring teeth. The workpiece jumps due to gear meshing, and the removal efficiency of the workpiece to the workpiece is low，so more damage is caused.

With the further increase in the demand for electronic ceramics in the market, alumina ceramic electronic substrates with high dimensional accuracy, shape accuracy and low surface roughness will continue to be reused, thus achieving ultra-smooth flattening of the surface of alumina ceramic substrates is the key and development trend of substrate substrate material preparation technology.